Futureproofing Semiconductor Materials: Polyimide Expansion by 2030
Diversified global manufacturer Asahi Kasei will increase PIMELTM photosensitive polyimide (PSPI) production capacity at its Fuji City facility in Shizuoka Prefecture, Japan. PSPI is a key material for the global electronics industry, mainly used for buffer coatings and passivation layers in semiconductor applications. By doubling its capacity by 2030, Asahi Kasei underlines its commitment to growing its Electronics business and reinforcing its position as a key supplier for the global semiconductor industry.
With the global semiconductor industry entering a new growth cycle and projected to surpass US$1 trillion in revenue by the mid-2030s, as reported by consulting firm Alvarez & Marsal, Asahi Kasei has forecasted that the demand for next-generation semiconductor interlayer insulation will continue to grow rapidly at an average annual growth rate of 8%.
In response to this quickly rising demand, Asahi Kasei completed the construction of a new plant producing PIMELTM photosensitive polyimide in Fuji City, Shizuoka Prefecture, in December 2024. Since then, the company has decided to expand production in Fuji City further, doubling the 2024 capacity by 2030. This expansion is expected to significantly improve the supply resilience of essential materials in the manufacturing of semiconductors. Asahi Kasei will invest approximately ¥16 billion in this expansion.
PIMELTM is used worldwide for various semiconductor applications, such as buffer coatings that improve adhesion between different semiconductor materials and act as protective barriers. These coatings help protect delicate semiconductor devices from mechanical stress and contamination during post-processing steps, such as mounting the chip onto a substrate.
PIMELTM is also used for passivation layers for bumping, which protect the semiconductor surface from damage or oxidation. Additionally, PIMELTM is used in redistribution layers (RDL), optimizing electrical connections and enabling high-density circuit designs by adjusting terminal spacing for package integration. These attributes have made PIMELTM an essential part of the global semiconductor supply chain and an enabling material in the development of next-generation generative AI.
Nobuko Uetake, Senior Executive Officer of Asahi Kasei and key leader in the company’s electronics materials business, commented, “The rapid growth of generative AI and other advanced technologies is driving unprecedented demand for semiconductor materials like PIMELTM PSPI. This investment positions Asahi Kasei to capture that growth by enhancing our supply capability and reinforcing our role as a reliable partner to global semiconductor manufacturers. It supports our broader strategy to build long-term value in high-growth, high-impact sectors.”
Asahi Kasei positions its electronics business in the “First Priority” category, one of the key drivers for future company growth. For many years, PIMELTM has been highly regarded as a key component for producing semiconductors. In 2024, Asahi Kasei received the TSMC Excellent Performance Award for “Excellent Technology Collaboration and Production Support in Advanced Packaging” at TSMC’s 2024 Supply Chain Management Forum.
In April 2025, Asahi Kasei announced its new medium-term management plan, “Trailblaze Together.” This plan continues the path of structural transformation and pursues carefully selected investments in strategic growth fields. By doing so, the company aims to maximize profitability and company value by 2030 and beyond.
#asahi-kasei#Modernplasticsindia #Pasticsnews #ModernPlasticsIndiaMagazine
#PrintPublication #PrintMagazine#modernplasticsnepal
